Separation of long, thin workpieces
Special device for UNISEPA
The separation of long, thin workpieces (cylinder spikes, axles etc.) through vibratory separation encounters the problem that grinding or polishing chips are bigger than the workpiece diameter. During the separation process the workpiece can stand up and fall through the screening sieve together with the grinding or polishing chips. In this case, several separation processes are necessary. This is time consuming and costly.
On request, OTEC can integrate a new attachment to the Unisepa, which prevents the long thin workpieces from standing up. A 100% separation without repeat of the separation process is possible.